Provide optimal heat transfer between CPU and heatsink through a metal oxide compound
Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink.
A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.
The StarTech.com Advantage
– Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications